The patternings of diamond films that were
fabricated by thermal CVD method, were studied about the important
parameters for the general circuit design. The minimum spacing
(S) and the minimum line width (X) were studied. Silicon-dioxide
was used for protecting the generation of undesirable diamond
film areas. From the experiments, it's found that the minimum
spacing is about 5 mm and the minimum line width is about 10
mm. The error of minimum spacing and minimum line width is about
15% and 23% respectively. These errors can decrease when both
of spacing and line widths increase. From this results, the
diamond films can be applied to electronic devices by using
these useful basic design rules and fabrications.
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